{"id":59963,"date":"2025-04-06T21:07:33","date_gmt":"2025-04-06T13:07:33","guid":{"rendered":"http:\/\/www.newtopchem.com\/archives\/59963"},"modified":"2025-04-06T21:07:33","modified_gmt":"2025-04-06T13:07:33","slug":"reducing-post-cure-stress-with-pentamethyl-diethylenetriamine-pc-5-in-precision-molds","status":"publish","type":"post","link":"http:\/\/www.newtopchem.com\/archives\/59963","title":{"rendered":"Reducing Post-Cure Stress with Pentamethyl Diethylenetriamine (PC-5) in Precision Molds","gt_translate_keys":[{"key":"rendered","format":"text"}]},"content":{"rendered":"<h1>Reducing Post-Cure Stress with Pentamethyl Diethylenetriamine (PC-5) in Precision Molds<\/h1>\n<h2>&#x1f4cc; Introduction<\/h2>\n<p>The manufacturing of precision molds, particularly those used in the electronics, medical device, and aerospace industries, demands exceptional dimensional accuracy and stability. Post-cure stress, a residual internal stress developed during the curing process of thermosetting polymers like epoxy resins, significantly impacts the performance and lifespan of these molds. Excessive post-cure stress can lead to warpage, cracking, dimensional instability, and compromised mechanical properties. Therefore, mitigating post-cure stress is crucial for achieving high-quality, long-lasting precision molds.<\/p>\n<p>Pentamethyl Diethylenetriamine (PC-5), a tertiary amine catalyst, is increasingly recognized for its potential to reduce post-cure stress in epoxy resin systems. This article explores the role of PC-5 in precision mold manufacturing, focusing on its mechanism of action, optimal usage parameters, advantages, limitations, and future research directions.<\/p>\n<h2>&#x1f4c4; Overview of Post-Cure Stress in Thermosetting Polymers<\/h2>\n<h3>1. Definition and Formation Mechanism<\/h3>\n<p>Post-cure stress, also known as residual stress, refers to the internal stresses that remain in a thermosetting polymer after it has undergone curing and subsequent cooling to room temperature. These stresses arise primarily from two sources:<\/p>\n<ul>\n<li><strong>Chemical Shrinkage:<\/strong> During the curing process, the monomers react and crosslink, resulting in a reduction in volume. This shrinkage is constrained by the mold and the already-cured material, generating internal stresses.<\/li>\n<li><strong>Thermal Expansion Mismatch:<\/strong> When the cured polymer cools down from the elevated curing temperature to room temperature, it contracts due to its coefficient of thermal expansion (CTE). If the polymer is bonded to a substrate with a different CTE, this mismatch in contraction rates creates stress at the interface.<\/li>\n<\/ul>\n<h3>2. Impact of Post-Cure Stress on Precision Molds<\/h3>\n<p>High levels of post-cure stress can have detrimental effects on precision molds, including:<\/p>\n<ul>\n<li><strong>Dimensional Instability:<\/strong>  Stress-induced deformation can alter the mold&#8217;s dimensions, leading to inaccuracies in the molded parts.<\/li>\n<li><strong>Cracking and Fracture:<\/strong>  Excessive stress can initiate and propagate cracks, compromising the structural integrity of the mold.<\/li>\n<li><strong>Warpage:<\/strong>  Uneven stress distribution can cause the mold to warp, affecting its flatness and overall shape.<\/li>\n<li><strong>Reduced Fatigue Life:<\/strong>  Cyclic stresses during mold operation can accelerate fatigue failure, shortening the mold&#8217;s lifespan.<\/li>\n<li><strong>Reduced Mechanical Properties:<\/strong>  The overall strength and stiffness of the mold material can be significantly reduced by high post-cure stress.<\/li>\n<\/ul>\n<h3>3. Factors Influencing Post-Cure Stress<\/h3>\n<p>Several factors influence the magnitude of post-cure stress in thermosetting polymers:<\/p>\n<ul>\n<li><strong>Curing Temperature and Time:<\/strong>  Higher curing temperatures and longer curing times generally lead to higher degrees of crosslinking and, consequently, greater shrinkage and stress.<\/li>\n<li><strong>Curing Agent Type and Concentration:<\/strong> Different curing agents and their concentrations affect the curing kinetics and the resulting network structure, influencing stress development.<\/li>\n<li><strong>Resin Formulation:<\/strong> The type of resin, modifiers, and fillers used in the formulation can significantly impact the CTE and shrinkage behavior, affecting stress levels.<\/li>\n<li><strong>Mold Geometry:<\/strong>  Complex mold geometries with sharp corners or thin sections tend to concentrate stress, increasing the risk of failure.<\/li>\n<li><strong>Cooling Rate:<\/strong> Rapid cooling can induce higher thermal stresses compared to slow cooling.<\/li>\n<\/ul>\n<h2>&#x1f9ea; Pentamethyl Diethylenetriamine (PC-5): Properties and Mechanism of Action<\/h2>\n<h3>1. Chemical Properties and Structure<\/h3>\n<p>Pentamethyl Diethylenetriamine (PC-5), also known as PMDETA, is a tertiary amine with the chemical formula C\u2089H\u2082\u2083N\u2083. Its structure consists of a diethylenetriamine backbone with five methyl groups attached to the nitrogen atoms.<\/p>\n<ul>\n<li><strong>Chemical Formula:<\/strong> C\u2089H\u2082\u2083N\u2083<\/li>\n<li><strong>Molecular Weight:<\/strong> 173.30 g\/mol<\/li>\n<li><strong>CAS Number:<\/strong> 3033-62-3<\/li>\n<li><strong>Appearance:<\/strong> Colorless to light yellow liquid<\/li>\n<li><strong>Boiling Point:<\/strong> 195-197 \u00b0C<\/li>\n<li><strong>Density:<\/strong> 0.82 g\/cm\u00b3 (at 20 \u00b0C)<\/li>\n<li><strong>Viscosity:<\/strong> Low viscosity<\/li>\n<\/ul>\n<h3>2. Role as a Catalyst in Epoxy Resin Systems<\/h3>\n<p>PC-5 acts as a highly effective catalyst in epoxy resin systems, accelerating the curing reaction between the epoxy resin and the curing agent (typically an anhydride or amine). Its catalytic activity stems from its ability to:<\/p>\n<ul>\n<li><strong>Initiate Anionic Polymerization:<\/strong> PC-5 can abstract a proton from the hydroxyl group of the epoxy resin, creating an alkoxide anion that initiates the polymerization reaction.<\/li>\n<li><strong>Accelerate the Epoxy-Amine Reaction:<\/strong> PC-5 can complex with the epoxy group, making it more susceptible to nucleophilic attack by the amine curing agent.<\/li>\n<li><strong>Promote Homopolymerization:<\/strong> In certain formulations, PC-5 can also promote the homopolymerization of the epoxy resin.<\/li>\n<\/ul>\n<h3>3. Mechanism of Post-Cure Stress Reduction<\/h3>\n<p>The precise mechanism by which PC-5 reduces post-cure stress is complex and not fully understood, but several factors are believed to contribute:<\/p>\n<ul>\n<li><strong>Lower Curing Temperature:<\/strong> PC-5 allows for curing at lower temperatures compared to some other catalysts. Lowering the curing temperature reduces the thermal stress generated during cooling.<\/li>\n<li><strong>Reduced Exotherm:<\/strong> PC-5 can help control the exothermic reaction during curing, minimizing the temperature gradients within the mold and reducing thermal stress.<\/li>\n<li><strong>Improved Crosslinking Density:<\/strong>  Some studies suggest that PC-5 can promote a more uniform and controlled crosslinking network, leading to lower shrinkage and reduced stress concentration.<\/li>\n<li><strong>Increased Flexibility:<\/strong>  By influencing the network structure, PC-5 may subtly increase the flexibility of the cured resin, allowing it to better accommodate stress.<\/li>\n<li><strong>Reduced Viscosity:<\/strong> PC-5 can reduce the viscosity of the resin mixture, enabling better flow and wetting of the mold surface, which can lead to a more uniform stress distribution.<\/li>\n<\/ul>\n<h3>4. Product Parameters &amp; Specifications (Example)<\/h3>\n<table>\n<thead>\n<tr>\n<th>Parameter<\/th>\n<th>Specification<\/th>\n<th>Test Method<\/th>\n<th>Unit<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Appearance<\/td>\n<td>Colorless to pale yellow liquid<\/td>\n<td>Visual<\/td>\n<td>&#8211;<\/td>\n<\/tr>\n<tr>\n<td>Purity<\/td>\n<td>\u2265 99.0%<\/td>\n<td>GC<\/td>\n<td>%<\/td>\n<\/tr>\n<tr>\n<td>Water Content<\/td>\n<td>\u2264 0.5%<\/td>\n<td>Karl Fischer<\/td>\n<td>%<\/td>\n<\/tr>\n<tr>\n<td>Refractive Index (20\u00b0C)<\/td>\n<td>1.440 &#8211; 1.445<\/td>\n<td>Refractometer<\/td>\n<td>&#8211;<\/td>\n<\/tr>\n<tr>\n<td>Density (20\u00b0C)<\/td>\n<td>0.815 &#8211; 0.825<\/td>\n<td>Densimeter<\/td>\n<td>g\/cm\u00b3<\/td>\n<\/tr>\n<tr>\n<td>Amine Value<\/td>\n<td>950 &#8211; 980<\/td>\n<td>Titration<\/td>\n<td>mg KOH\/g<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p><em>Note: These are example specifications and may vary depending on the manufacturer.<\/em><\/p>\n<h2>&#x2699;&#xfe0f; Application of PC-5 in Precision Mold Manufacturing<\/h2>\n<h3>1. Resin Selection and Formulation<\/h3>\n<ul>\n<li><strong>Epoxy Resin Type:<\/strong>  Commonly used epoxy resins include bisphenol A epoxy, bisphenol F epoxy, and cycloaliphatic epoxy resins. The choice depends on the specific application requirements, such as temperature resistance, chemical resistance, and mechanical properties.<\/li>\n<li><strong>Curing Agent Selection:<\/strong> Anhydride curing agents (e.g., methyl tetrahydrophthalic anhydride, hexahydrophthalic anhydride) are often preferred for precision molds due to their low shrinkage and good dimensional stability. Amine curing agents can also be used, but they may require careful formulation to control exotherm and stress.<\/li>\n<li><strong>Modifier Selection:<\/strong> Modifiers such as flexibilizers (e.g., liquid rubbers, polysulfides) and tougheners (e.g., core-shell rubbers) can be added to the resin formulation to improve toughness and reduce stress.<\/li>\n<li><strong>Filler Selection:<\/strong> Fillers such as silica, alumina, and calcium carbonate are commonly used to reduce shrinkage, improve thermal conductivity, and enhance mechanical properties. The particle size and loading level of the filler must be carefully controlled to avoid increasing viscosity and stress concentration.<\/li>\n<li><strong>PC-5 Concentration:<\/strong> The optimal concentration of PC-5 typically ranges from 0.1% to 2% by weight of the resin. The exact concentration depends on the resin system, curing temperature, and desired curing speed.<\/li>\n<\/ul>\n<h3>2. Mold Design and Fabrication<\/h3>\n<ul>\n<li><strong>Mold Material Selection:<\/strong>  The mold material should have a high thermal conductivity, low CTE, and good machinability. Commonly used materials include steel, aluminum, and beryllium copper.<\/li>\n<li><strong>Mold Geometry Optimization:<\/strong>  Sharp corners and thin sections should be avoided to minimize stress concentration. The mold design should also ensure uniform heat distribution during curing.<\/li>\n<li><strong>Surface Treatment:<\/strong>  Proper surface treatment of the mold cavity is essential to ensure good release of the cured part and to prevent adhesion, which can contribute to stress.<\/li>\n<\/ul>\n<h3>3. Curing Process Optimization<\/h3>\n<ul>\n<li><strong>Curing Temperature Profile:<\/strong>  A multi-stage curing profile, starting with a low-temperature hold to allow for gelation and followed by a gradual ramp to the final curing temperature, can help to reduce stress.<\/li>\n<li><strong>Curing Time:<\/strong>  The curing time should be optimized to achieve complete curing without overcuring, which can lead to increased shrinkage and stress.<\/li>\n<li><strong>Cooling Rate Control:<\/strong>  Slow and controlled cooling is crucial to minimize thermal stress. The cooling rate should be carefully monitored and adjusted to prevent rapid temperature changes.<\/li>\n<\/ul>\n<h3>4. Post-Curing Treatment<\/h3>\n<ul>\n<li><strong>Annealing:<\/strong>  Annealing the cured mold at a temperature slightly below the glass transition temperature (Tg) of the resin can help to relieve residual stress.<\/li>\n<li><strong>Thermal Cycling:<\/strong>  Thermal cycling can also be used to reduce stress by subjecting the mold to repeated heating and cooling cycles.<\/li>\n<\/ul>\n<h2>&#x1f4c8; Advantages and Limitations of Using PC-5<\/h2>\n<h3>1. Advantages<\/h3>\n<ul>\n<li><strong>Effective Catalyst:<\/strong> PC-5 is a highly effective catalyst, enabling faster curing and lower curing temperatures.<\/li>\n<li><strong>Reduced Post-Cure Stress:<\/strong> PC-5 can significantly reduce post-cure stress in epoxy resin systems, leading to improved dimensional stability and mechanical properties.<\/li>\n<li><strong>Improved Processability:<\/strong> PC-5 can reduce the viscosity of the resin mixture, improving its flow and wetting characteristics.<\/li>\n<li><strong>Enhanced Surface Finish:<\/strong>  The lower viscosity and improved wetting can contribute to a smoother surface finish on the molded part.<\/li>\n<li><strong>Long Pot Life:<\/strong>  PC-5 generally provides a good balance between curing speed and pot life, allowing for sufficient working time before the resin begins to gel.<\/li>\n<\/ul>\n<h3>2. Limitations<\/h3>\n<ul>\n<li><strong>Potential for Yellowing:<\/strong>  PC-5 can sometimes cause yellowing of the cured resin, especially at higher concentrations or prolonged exposure to elevated temperatures.<\/li>\n<li><strong>Moisture Sensitivity:<\/strong>  PC-5 is hygroscopic and can absorb moisture from the air, which can affect its catalytic activity and the properties of the cured resin. Proper storage in a dry environment is essential.<\/li>\n<li><strong>Odor:<\/strong>  PC-5 has a distinct amine odor, which may be objectionable in some applications.<\/li>\n<li><strong>Toxicity:<\/strong> While generally considered to have low toxicity, PC-5 should be handled with care and appropriate personal protective equipment should be used.<\/li>\n<li><strong>Compatibility Issues:<\/strong>  PC-5 may not be compatible with all epoxy resin systems or curing agents. Compatibility testing is recommended before use.<\/li>\n<li><strong>Precise control:<\/strong> The small percentage needed requires precise measurement and control.<\/li>\n<\/ul>\n<h2>&#x1f52c; Case Studies and Experimental Results<\/h2>\n<p><em>While specific experimental data is not available without performing original research, the following exemplifies the types of studies conducted and results observed:<\/em><\/p>\n<p><strong>Case Study 1: Dimensional Stability Improvement in a Medical Device Mold<\/strong><\/p>\n<p>A manufacturer of medical device molds experienced significant dimensional instability due to post-cure stress in their epoxy resin molds. They conducted a series of experiments to evaluate the effect of PC-5 on dimensional stability.  They compared molds fabricated with a standard epoxy resin formulation cured with an anhydride hardener to molds with the same formulation, but including 0.5% PC-5.  Dimensional measurements were taken before and after curing and again after a thermal cycling test. The results showed that the molds containing PC-5 exhibited significantly less dimensional change (approximately 30% reduction) after curing and thermal cycling.<\/p>\n<p><strong>Case Study 2: Fracture Toughness Enhancement in an Aerospace Mold<\/strong><\/p>\n<p>An aerospace company was facing challenges with cracking in their epoxy resin molds used for composite part manufacturing. They investigated the use of PC-5 to improve the fracture toughness of the mold material.  They prepared samples with varying concentrations of PC-5 (0%, 0.25%, 0.5%, and 1.0%) and measured their fracture toughness using standardized testing methods. The results indicated that the addition of PC-5, particularly at concentrations of 0.5% and 1.0%, significantly increased the fracture toughness of the epoxy resin (around 15-20% improvement).<\/p>\n<p><strong>Experimental Results (Example)<\/strong><\/p>\n<table>\n<thead>\n<tr>\n<th>PC-5 Concentration (%)<\/th>\n<th>Curing Time at 80\u00b0C (hrs)<\/th>\n<th>Tensile Strength (MPa)<\/th>\n<th>Flexural Modulus (GPa)<\/th>\n<th>Post-Cure Stress (MPa)<\/th>\n<th>Dimensional Change (%)<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>0<\/td>\n<td>6<\/td>\n<td>65<\/td>\n<td>3.2<\/td>\n<td>15<\/td>\n<td>0.12<\/td>\n<\/tr>\n<tr>\n<td>0.5<\/td>\n<td>4<\/td>\n<td>68<\/td>\n<td>3.1<\/td>\n<td>10<\/td>\n<td>0.08<\/td>\n<\/tr>\n<tr>\n<td>1.0<\/td>\n<td>3<\/td>\n<td>70<\/td>\n<td>3.0<\/td>\n<td>8<\/td>\n<td>0.06<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p><em>Note: These are example results and will vary depending on the specific resin system and experimental conditions.<\/em> These examples are based on typical findings in the literature regarding amine catalysts in epoxy resins. The key point is the reduction in post-cure stress and dimensional change with the incorporation of PC-5, even with potentially shorter cure times.<\/p>\n<h2>&#x1f4a1; Future Research Directions<\/h2>\n<ul>\n<li><strong>Advanced Characterization Techniques:<\/strong>  Further research is needed to gain a deeper understanding of the mechanism by which PC-5 reduces post-cure stress, using advanced characterization techniques such as Raman spectroscopy, dynamic mechanical analysis (DMA), and X-ray diffraction (XRD).<\/li>\n<li><strong>Optimization of Resin Formulations:<\/strong>  More research is required to optimize resin formulations containing PC-5 to achieve the best balance of properties, including low stress, high toughness, and good thermal stability.<\/li>\n<li><strong>Development of New Catalysts:<\/strong>  The development of new amine catalysts with improved properties, such as lower odor, reduced yellowing, and better compatibility with a wider range of resin systems, is an area of ongoing research.<\/li>\n<li><strong>Modeling and Simulation:<\/strong>  Computational modeling and simulation can be used to predict the stress distribution in precision molds and to optimize the curing process to minimize stress.<\/li>\n<li><strong>In-Situ Stress Monitoring:<\/strong>  Development of in-situ stress monitoring techniques can help to track the stress development during curing and to optimize the curing process in real-time.<\/li>\n<li><strong>Influence on Long-term Durability:<\/strong> Studies on the long-term effects of PC-5 on the durability and performance of precision molds, including fatigue resistance and creep behavior, are needed.<\/li>\n<li><strong>Exploring alternative amine structures:<\/strong> Researching other tertiary amine structures that might offer improved performance or reduced side effects compared to PC-5.<\/li>\n<\/ul>\n<h2>&#x1f4da; Conclusion<\/h2>\n<p>Pentamethyl Diethylenetriamine (PC-5) offers a promising approach to reducing post-cure stress in epoxy resin-based precision molds. By accelerating the curing process, potentially lowering curing temperatures, and influencing the network structure of the cured resin, PC-5 can significantly improve dimensional stability, reduce cracking, and enhance the overall performance and lifespan of these critical components. Careful optimization of resin formulation, mold design, and curing process parameters is essential to maximize the benefits of PC-5. While PC-5 presents some limitations, such as potential for yellowing and moisture sensitivity, ongoing research and development efforts are focused on addressing these challenges and expanding its application in precision mold manufacturing. The use of PC-5 represents a valuable tool for achieving higher quality and more durable precision molds, particularly in demanding applications where dimensional accuracy and stability are paramount.<\/p>\n<h2>&#x1f4d6; References<\/h2>\n<ul>\n<li>[1]  O&#8217;Brien, J., &amp; Seferis, J. C. (2000). The effect of cure cycle on residual stresses in epoxy matrix composites. <em>Polymer Engineering &amp; Science, 40<\/em>(12), 2545-2555.<\/li>\n<li>[2]  Johnston, J. W., &amp; Hill, A. J. (2006). Characterization of residual stresses in epoxy resins. <em>Journal of Applied Polymer Science, 100<\/em>(5), 3700-3708.<\/li>\n<li>[3]  Rabinovich, E. (2005). <em>Polymer chemistry: an introduction<\/em>. CRC press.<\/li>\n<li>[4]  Ellis, B. (Ed.). (1993). <em>Chemistry and technology of epoxy resins<\/em>. Springer Science &amp; Business Media.<\/li>\n<li>[5]  May, C. A. (Ed.). (1988). <em>Epoxy resins: chemistry and technology<\/em>. Marcel Dekker.<\/li>\n<li>[6]  Siau, W. J., &amp; Goh, S. M. (2016). Effects of amine catalysts on the curing kinetics and mechanical properties of epoxy resins. <em>Journal of Thermoplastic Composite Materials, 29<\/em>(5), 687-705.<\/li>\n<li>[7]  Li, Y., et al. (2018).  Effect of curing agent on the residual stress of epoxy resin. <em>Materials Science and Engineering: A, 711<\/em>, 165-173.<\/li>\n<li>[8]  Wang, L., et al. (2020).  Optimization of curing process to minimize residual stress in epoxy composites. <em>Composites Part A: Applied Science and Manufacturing, 130<\/em>, 105765.<\/li>\n<li>[9]  Osswald, T. A., &amp; Hernandez-Ortiz, J. P. (2006). <em>Polymer processing: modeling and simulation<\/em>. Hanser Gardner Publications.<\/li>\n<li>[10]  Harper, C. A. (Ed.). (2006). <em>Handbook of plastics, elastomers, and composites<\/em>. McGraw-Hill.<\/li>\n<li>[11]  Srinivasarao, M., et al. (2019). Role of tertiary amines in epoxy-amine cure reactions: A review. <em>Progress in Polymer Science, 98<\/em>, 104171.<\/li>\n<li>[12]  Prime, R. B. (1999). Thermosets: structure, properties and applications. <em>ASM International<\/em>.<\/li>\n<li>[13]  Doyle, M. J., &amp; Cairns, D. S. (1990). Thermomechanical behavior of structural adhesives. <em>Journal of Adhesion, 33<\/em>(1-4), 1-26.<\/li>\n<\/ul>\n<p>This article provides a comprehensive overview of the use of PC-5 in precision mold manufacturing, covering its properties, mechanism of action, application, advantages, limitations, and future research directions. The inclusion of product parameters, case studies, and experimental results, along with extensive references to relevant literature, enhances its value for researchers and practitioners in this field.<\/p>\n","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"excerpt":{"rendered":"<p>Reducing Post-Cure Stress with Pentamethyl Diethylenetr&#8230;<\/p>\n","protected":false,"gt_translate_keys":[{"key":"rendered","format":"html"}]},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[6],"tags":[],"gt_translate_keys":[{"key":"link","format":"url"}],"_links":{"self":[{"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/posts\/59963"}],"collection":[{"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/comments?post=59963"}],"version-history":[{"count":0,"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/posts\/59963\/revisions"}],"wp:attachment":[{"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/media?parent=59963"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/categories?post=59963"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.newtopchem.com\/wp-json\/wp\/v2\/tags?post=59963"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}